- Patent Title: Radio wave absorber and manufacturing method of radio wave absorber
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Application No.: US16580103Application Date: 2019-09-24
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Publication No.: US10777904B2Publication Date: 2020-09-15
- Inventor: Tatsuo Mikami , Hirotoshi Yoshizawa
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@57ca0ae3
- Main IPC: H01Q17/00
- IPC: H01Q17/00 ; B65D83/28 ; G02B1/118

Abstract:
Provided is a radio wave absorber including: a support; a first radio wave absorption layer having a flat plate shape that is disposed on a surface of the support and includes a radio wave absorption material and a binder; and second radio wave absorption layers that are erected on a surface of the first radio wave absorption layer, include a radio wave absorption material and a binder, and are conical protrusions having bottom surfaces of which outer peripheral portions are in contact with each other, in which a distance between apexes of the conical protrusions adjacent to each other is 0.5 mm to λa mm, in a case where a wavelength of a radio wave to be absorbed is set as λa mm, and a manufacturing method of a radio wave absorber.
Public/Granted literature
- US20200021036A1 RADIO WAVE ABSORBER AND MANUFACTURING METHOD OF RADIO WAVE ABSORBER Public/Granted day:2020-01-16
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