- Patent Title: Systems and methods for a modular enclosure with a door interlock
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Application No.: US15966964Application Date: 2018-04-30
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Publication No.: US10777978B2Publication Date: 2020-09-15
- Inventor: Jordan E. Rogers , Ahmad K. Omari
- Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Quarles & Brady LLP
- Main IPC: H02G3/08
- IPC: H02G3/08 ; H02B1/14 ; A47B47/00 ; E05B65/06 ; E05C3/14 ; H02B1/30 ; H02B1/38 ; H05K5/02

Abstract:
A modular enclosure comprises a first enclosure having a first enclosure cavity and a first door, and a second enclosure coupled to the first enclosure, the second enclosure having a second enclosure cavity and a second door. A power handle may be connected to the first enclosure, and can be operable to turn on power to the second enclosure in an “ON” position or turn off power to the second enclosure in an “OFF” position. The modular enclosure may further include a lockout assembly configured to prevent the second door from being opened while the power handle is in the “ON” position, and to prevent the first door from being opened until second door has been opened.
Public/Granted literature
- US10811853B2 Systems and methods for a modular enclosure with a door interlock Public/Granted day:2020-10-20
Information query
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