Invention Grant
- Patent Title: Fin field effect transistor fabrication and devices having inverted T-shaped gate
-
Application No.: US16264955Application Date: 2019-02-01
-
Publication No.: US10784365B2Publication Date: 2020-09-22
- Inventor: Veeraraghavan S. Basker , Zuoguang Liu , Tenko Yamashita , Chun-Chen Yeh
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/417 ; H01L29/423 ; H01L29/49 ; H01L29/78 ; H01L29/40 ; H01L21/311 ; H01L21/62 ; H01L21/3213 ; H01L21/8234 ; H01L21/3065 ; H01L21/265 ; H01L21/02 ; H01L29/08 ; H01L27/088

Abstract:
A method of forming a fin field effect transistor (finFET), including forming a temporary gate structure having a sacrificial gate layer and a dummy gate layer on the sacrificial gate layer, forming a gate spacer layer on each sidewall of the temporary gate structure, forming a source/drain spacer layer on the outward-facing sidewall of each gate spacer layer, removing the dummy gate layer to expose the sacrificial gate layer, removing the sacrificial gate layer to form a plurality of recessed cavities, and forming a gate structure, where the gate structure occupies at least a portion of the plurality of recessed cavities.
Public/Granted literature
- US20190165142A1 FIN FIELD EFFECT TRANSISTOR FABRICATION AND DEVICES HAVING INVERTED T-SHAPED GATE Public/Granted day:2019-05-30
Information query
IPC分类: