The present invention provides a sealing apparatus having a structure in which an application area of pressure and heat is increased by a pair of sealing blocks and a pressurization part extending from the sealing block. In the sealing apparatus according to the present invention based on the structure, when the sealing-planned part is pressurized, heat and pressure may be applied to the sealing-planned part or an insulating film to be extended, and thus an electrode lead and the sealing-planned part adjacent thereto may be firmly bonded.