Invention Grant
- Patent Title: Module mount interposer
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Application No.: US16286405Application Date: 2019-02-26
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Publication No.: US10784602B2Publication Date: 2020-09-22
- Inventor: Jia Lian , Huaping Peng , Shamei Shi , William H Wang , Frank Flens , Henricus Jozef Vergeest
- Applicant: FINISAR CORPORATION
- Applicant Address: US DE Wilmington
- Assignee: II-VI Delaware Inc.
- Current Assignee: II-VI Delaware Inc.
- Current Assignee Address: US DE Wilmington
- Agency: Maschoff Brennan
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R12/71 ; H05K3/34 ; H01L23/492 ; H05K1/18

Abstract:
A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.
Public/Granted literature
- US20200059022A1 Module Mount Interposer Public/Granted day:2020-02-20
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