Invention Grant
- Patent Title: Female connector and transmission wafer
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Application No.: US16568255Application Date: 2019-09-12
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Publication No.: US10784630B1Publication Date: 2020-09-22
- Inventor: Chih-Wei Chen , Chung-Nan Pao , Yueh-Lin Yang , Yu-Hsiung Lin , Kai Wu , Yan-Bo Lin
- Applicant: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
- Applicant Address: CN Suzhou, Jiangsu Province
- Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
- Current Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
- Current Assignee Address: CN Suzhou, Jiangsu Province
- Agency: Li & Cai Intellectual Property Office
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6cf6abe
- Main IPC: H01R13/6586
- IPC: H01R13/6586 ; H01R13/6597 ; H01R13/50 ; H01R13/646 ; H01R13/514 ; H01R13/6587

Abstract:
A female connector and a transmission wafer are provided. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a first shielding member and a second shielding member respectively disposed on two opposite sides of the insulating frame. In each of the transmission wafers, the second shielding member is disposed on a front end portion of the insulating frame, and the first and second shielding members are electrically connected to the grounding terminals so as to be electrically connected to each other through the grounding terminals. The second shielding member of one of any two adjacent transmission wafers is abutted against and electrically connected to the first shielding member of the other one of the any two adjacent transmission wafers.
Public/Granted literature
- US20200287332A1 FEMALE CONNECTOR AND TRANSMISSION WAFER Public/Granted day:2020-09-10
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