Invention Grant
- Patent Title: Method of manufacturing multilayer capacitor
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Application No.: US16443908Application Date: 2019-06-18
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Publication No.: US10790090B2Publication Date: 2020-09-29
- Inventor: Sui Uno , Takashi Sawada , Yohei Mukobata
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@74f9854e
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/232

Abstract:
In a method for manufacturing a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.
Public/Granted literature
- US20190304699A1 MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR Public/Granted day:2019-10-03
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