A conductive pattern structure is provided by the embodiment of present disclosure. The conductive pattern structure includes: a first metal pattern and a second metal pattern. The second metal pattern covers at least a portion of a side surface of the first metal pattern; and an activity of a metal material of the first metal pattern is weaker than an activity of a metal material of the second metal pattern. The embodiment of present disclosure prevents the side surface of the first metal pattern from being oxidized by forming the second metal pattern covering at least a portion of the side surface of the first metal pattern, in this way, the problem that the electrical conductivity of the first metal pattern is reduced is avoided, and the problem that product yield declining is avoided.