Invention Grant
- Patent Title: Removing apparatus and method
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Application No.: US16199462Application Date: 2018-11-26
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Publication No.: US10790649B2Publication Date: 2020-09-29
- Inventor: Takuro Yoshimura , Kotaro Yoshida , Ryuzo Sakamoto , Masafumi Saito , Keisuke Yoshida
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@30fe1d3
- Main IPC: H02G1/12
- IPC: H02G1/12 ; H02B15/00 ; H01B15/00

Abstract:
A removing apparatus (2) includes a first removing section (11) and a second removing section (12). The first removing section (11) includes a rotating disk (15) and a driven roller (16). The rotating disk (15) has a pair of left and right first to fourth left and right removing blades (21) to (24) attached thereto. When the rotating disk (15) rotates in a counterclockwise direction, a coil conductive wire (3) sandwiched between the rotating disk (15) and the driven roller (16) is transferred in a transfer direction. When the rotating disk (15) rotates in a counterclockwise direction, the left and right side surface portions of the insulating coating (4) are removed by a blade portion (21b) of a pair of left and right first left and right removing blades (21).
Public/Granted literature
- US20190165555A1 REMOVING APPARATUS AND METHOD Public/Granted day:2019-05-30
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