Invention Grant
- Patent Title: Cutting modules
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Application No.: US16073385Application Date: 2016-04-26
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Publication No.: US10792829B2Publication Date: 2020-10-06
- Inventor: Isabel Sanz Ananos , Martin Urrutia Nebreda
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2016/029380 WO 20160426
- International Announcement: WO2017/188937 WO 20171102
- Main IPC: B26D1/24
- IPC: B26D1/24 ; B26D1/14 ; B26D1/18 ; B41J11/66 ; B41J11/68 ; B41J11/70

Abstract:
In An example cutting module comprises a housing to engage the cutting module with a drive shaft, a cutter engaged with the housing, and a drive system engaged with the housing. The cutting module movable along the drive shaft laterally to a media path, the cutter cuts media along the media path, and the drive system may lock when the drive shaft rotates in a second drive direction such that the cutting module moves with the drive shaft.
Public/Granted literature
- US20190061191A1 CUTTING MODULES Public/Granted day:2019-02-28
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