Invention Grant
- Patent Title: Method to form an inductive component
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Application No.: US16709884Application Date: 2019-12-10
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Publication No.: US10796842B2Publication Date: 2020-10-06
- Inventor: Yi-Min Huang , Chih-Siang Chuang , Yung-Cheng Chang
- Applicant: CYNTEC CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC CO., LTD.
- Current Assignee: CYNTEC CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Litron Patent & Trademark Office
- Agent Min-Lee Teng
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F17/00 ; H01F17/06

Abstract:
A method to from an inductive component, the method including forming a metal structure having a conductor wire and a lead frame having a first part and a second part space spaced apart from the first part and forming a magnetic body encapsulating the conductor wire, a first portion of the first part and a second portion of the second part of the lead frame adjacent to the conductor wire.
Public/Granted literature
- US20200118735A1 METHOD TO FORM AN INDUCTIVE COMPONENT Public/Granted day:2020-04-16
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