- 专利标题: Multilayer capacitor
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申请号: US16184337申请日: 2018-11-08
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公开(公告)号: US10796855B2公开(公告)日: 2020-10-06
- 发明人: Sung Hyung Kang , Yong Koo Kim , Hyung Kyu Kim , Won Hee Yoo , Jong Hyun Cho , Byung Kil Yun , Seok Kyoon Woo , Hyun Sung Dong
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@18c5cb56
- 主分类号: H01G4/232
- IPC分类号: H01G4/232 ; H01G4/248 ; H01G4/30 ; H01G4/008 ; H01G4/12
摘要:
A multilayer capacitor includes a body, including a stacked structure formed of a plurality of dielectric layers and a plurality of internal electrodes, and a plurality of external electrodes. Each external electrode includes a conductive layer, disposed at the end of the body and connected to the plurality of internal electrodes, and a plating layer covering the conductive layer. Each conductive layer includes nickel (Ni) and barium titanate (BT), and an area occupied by nickel with respect to the total area of the respective conductive layer is 30% to 65%.
公开/授权文献
- US20200058443A1 MULTILAYER CAPACITOR 公开/授权日:2020-02-20
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