- 专利标题： Method for bonding semiconductor chips to a landing wafer
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申请号： US15798939申请日： 2017-10-31
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公开(公告)号： US10797016B2公开(公告)日： 2020-10-06
- 发明人: Vikas Dubey , Eric Beyne , Giovanni Capuz
- 申请人： IMEC VZW , Katholieke Universiteit Leuven
- 申请人地址： BE Leuven BE Leuven
- 专利权人： IMEC vzw,Katholieke Universiteit Leuven
- 当前专利权人： IMEC vzw,Katholieke Universiteit Leuven
- 当前专利权人地址： BE Leuven BE Leuven
- 代理机构： Knobbe Martens Olson & Bear LLP
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@34eed327
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
A method for bonding chips to a landing wafer is disclosed. In one aspect, a volume of alignment liquid is dispensed on a wettable surface of the chip so as to become attached to the surface, after which the chip is moved towards the bonding site on the wafer, the bonding site equally being provided with a wettable surface. A liquid bridge is formed between the chip and the bonding site on the substrate wafer, enabling self-alignment of the chip. Dispensing alignment liquid on the chip and not the wafer is advantageous in terms of mitigating unwanted evaporation of the liquid prior to bonding.