- 专利标题： Printed wiring board
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申请号： US16524225申请日： 2019-07-29
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公开(公告)号： US10804621B2公开(公告)日： 2020-10-13
- 发明人: Akira Tanaka , Masaya Hirashima , Satoru Yasui , Shukuyo Yamada , Masashi Watanabe
- 申请人： KABUSHIKI KAISHA TOSHIBA
- 申请人地址： JP Minato-ku
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Minato-ku
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@e6e6350
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H01R4/02 ; H05K1/11
摘要：
According to one embodiment, a printed wiring board includes a wiring board, a connector part, a connection pad provided between the wiring board and the connector part and connected with the connector part with a solder material and a guide groove provided in the wiring board to be continuous to the connection pad, to guide a portion of the solder material from the connection pad.
公开/授权文献
- US20200044366A1 PRINTED WIRING BOARD 公开/授权日：2020-02-06
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