Invention Grant
- Patent Title: Method for fabricating low and high/medium voltage transistors on substrate
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Application No.: US16173406Application Date: 2018-10-29
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Publication No.: US10825522B2Publication Date: 2020-11-03
- Inventor: Liang Yi , Zhaobing Li , Chi Ren
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: G11C16/04
- IPC: G11C16/04 ; H01L45/00 ; G11C13/00 ; H01L27/11517

Abstract:
A structure of nonvolatile memory device includes a substrate, having a logic device region and a memory cell region. A first gate structure for a low-voltage transistor is disposed over the substrate in the logic device region, wherein the first gate structure comprises a single-layer polysilicon. A second gate structure for a memory cell is disposed over the substrate in the memory cell region. The second gate structure includes a gate insulating layer on the substrate. A floating gate layer is disposed on the gate insulating layer, wherein the floating gate layer comprises a first polysilicon layer and a second polysilicon layer as a stacked structure. A memory dielectric layer is disposed on the floating gate layer. A control gate layer is disposed on the memory dielectric layer, wherein the control gate layer and the single-layer polysilicon are originated from a preliminary polysilicon layer in same.
Public/Granted literature
- US20200135274A1 NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2020-04-30
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