Invention Grant
- Patent Title: Laminated electronic component
-
Application No.: US16840732Application Date: 2020-04-06
-
Publication No.: US10825596B2Publication Date: 2020-11-03
- Inventor: Shunji Aoki , Yuya Ishima , Hajime Kato , Yuto Shiga , Kazuya Tobita , Youichi Kazuta , Satoru Okamoto
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@20548375
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01G4/012 ; H01F27/29 ; H01G4/12 ; H01G4/30 ; H01G4/005

Abstract:
A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.
Public/Granted literature
- US20200234865A1 LAMINATED ELECTRONIC COMPONENT Public/Granted day:2020-07-23
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |