Invention Grant
- Patent Title: Coil component and method of manufacturing the same
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Application No.: US15834745Application Date: 2017-12-07
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Publication No.: US10825600B2Publication Date: 2020-11-03
- Inventor: Il Ho Cha , Sang Jae Lee , Jae Ha Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@15cea362
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/32 ; H01F41/12 ; H01F27/29 ; H01F41/04 ; H01F27/24 ; H01F17/04 ; H01F17/00

Abstract:
A coil component includes: a first coil layer; and a second coil layer disposed on the first coil layer, wherein the first coil layer includes a first insulating layer and a first coil conductor embedded in the first insulating layer, the second coil layer includes a second insulating layer and a second coil conductor embedded in the second insulating layer, the first and second coil conductors are electrically connected to each other by a through-conductor formed in the first insulating layer, and cavities vertically penetrating through the first and second coil layers are provided in core regions of the first and second coil layers, respectively.
Public/Granted literature
- US20190019616A1 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-01-17
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