Invention Grant
- Patent Title: Tungsten frame of a haptic feedback module for a portable electronic device
-
Application No.: US16250938Application Date: 2019-01-17
-
Publication No.: US10831276B2Publication Date: 2020-11-10
- Inventor: Dominic P. Cincione , Matthew D. Dombach , Darya Amin-Shahidi , Scott D. Ridel , Vu A. Hong , Alex J. Speltz , Denis G. Chen
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Dorsey & Whitney LLP
- Main IPC: G06F3/01
- IPC: G06F3/01 ; H04M1/02 ; B06B1/04

Abstract:
According to some embodiments, a haptic feedback module for generating a haptic feedback event is described. The haptic feedback module includes an enclosure having walls that define a cavity. The enclosure is capable of carrying operational components within the cavity that include a frame that includes tungsten, a magnetic coil element that is capable of generating a magnetic field, a magnetic element that is carried within an aperture of the frame, linear-actuation end stops that are welded to a first end of the frame and a second end of the frame that opposes the first end, and springs that couple together the walls of the enclosure to the linear-actuation end stops.
Public/Granted literature
- US20200081540A1 TUNGSTEN FRAME OF A HAPTIC FEEDBACK MODULE FOR A PORTABLE ELECTRONIC DEVICE Public/Granted day:2020-03-12
Information query