Invention Grant
- Patent Title: Using unused wires on very-large-scale integration chips for power supply decoupling
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Application No.: US16553463Application Date: 2019-08-28
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Publication No.: US10831980B2Publication Date: 2020-11-10
- Inventor: Alan P. Wagstaff , David Wolpert
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Nathan M. Rau
- Main IPC: G06F30/398
- IPC: G06F30/398 ; G06F30/394 ; G06F111/20

Abstract:
Using unused wires on VLSI chips for power supply decoupling including generating a VLSI chip design by: identifying floating wires in a VLSI chip; placing a via at each intersection between each floating wire and a power rail; determining a number of design rule violations for each via at each intersection; resolving the design rule violations for each via not on a major power rail; resolving the design rule violations for each via on a major power rail after resolving the design rule violations for each via not on a major power rail; after resolving the design rule violations for each via on a major power rail, identifying floating wires without a via; and for each floating wire without a via, identify an intersection with a least number of design rule violations and resolve the number of design rule violations by removing adjacent vias on adjacent wires.
Public/Granted literature
- US20190384887A1 USING UNUSED WIRES ON VERY-LARGE-SCALE INTEGRATION CHIPS FOR POWER SUPPLY DECOUPLING Public/Granted day:2019-12-19
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