Invention Grant
- Patent Title: Composition for thermally conductive material and thermally conductive material
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Application No.: US16617053Application Date: 2018-06-01
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Publication No.: US10851236B2Publication Date: 2020-12-01
- Inventor: Hiroto Yoshino , Teruaki Yuoka
- Applicant: KITAGAWA INDUSTRIES CO., LTD.
- Applicant Address: JP Aichi
- Assignee: KITAGAWA INDUSTRIES CO., LTD.
- Current Assignee: KITAGAWA INDUSTRIES CO., LTD.
- Current Assignee Address: JP Aichi
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2017-109732 20170602; JP2018-103841 20180530
- International Application: PCT/JP2018/021154 WO 20180601
- International Announcement: WO2018/221719 WO 20181206
- Main IPC: C08L33/14
- IPC: C08L33/14 ; C08J3/20 ; C08J3/24

Abstract:
Provided is a grease-like thermally conductive material having excellent heat resistance including a non-silicone resin.Resolution Means:The composition for thermally conductive material of the present invention includes: an acrylic polymer (A) having at least two crosslinkable functional groups containing a carbon-carbon unsaturated bond; an acrylic polymer (B) having at least one of the crosslinkable functional groups; an anti-dripping agent; and a thermally conductive filler, a discharge amount being 1.50 g/min or more and 4.25 g/min or less as measured using a dispense controller under a predetermined discharge pressure condition.
Public/Granted literature
- US20200115538A1 COMPOSITION FOR THERMALLY CONDUCTIVE MATERIAL AND THERMALLY CONDUCTIVE MATERIAL Public/Granted day:2020-04-16
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