Invention Grant
- Patent Title: Dynamic temperature compensation in a memory component
-
Application No.: US16170423Application Date: 2018-10-25
-
Publication No.: US10852953B2Publication Date: 2020-12-01
- Inventor: Larry J. Koudele , Bruce A. Liikanen , Steve Kientz
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G11C7/04 ; G11C29/02 ; G11C16/34
Abstract:
A dynamic temperature compensation trim for use in temperature compensating a memory operation on a memory call of a memory component. The dynamic temperature compensation trim is based on a temperature of the memory component and based on in-service data for the memory operation on the memory cell. A register for the memory operation is modified based on the dynamic temperature compensation trim.
Public/Granted literature
- US20200133510A1 DYNAMIC TEMPERATURE COMPENSATION IN A MEMORY COMPONENT Public/Granted day:2020-04-30
Information query
