- 专利标题： Wafer level packaging of light emitting diodes (LEDs)
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申请号： US15499520申请日： 2017-04-27
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公开(公告)号： US10854584B2公开(公告)日： 2020-12-01
- 发明人: Michael John Bergmann , David Todd Emerson , Joseph G. Clark , Christopher P. Hussell
- 申请人： Cree, Inc.
- 申请人地址： US NC Durham
- 专利权人： CREE, INC.
- 当前专利权人： CREE, INC.
- 当前专利权人地址： US NC Durham
- 代理机构： Withrow & Terranova, P.L.L.C.
- 代理商 Vincent K. Gustafson
- 主分类号： H01L33/62
- IPC分类号： H01L33/62 ; H01L33/00 ; H01L33/38 ; H01L33/48 ; H01L33/50 ; H01L33/22 ; H01L25/075 ; H01L23/00
摘要：
An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.
公开/授权文献
- US20170229431A1 WAFER LEVEL PACKAGING OF LIGHT EMITTING DIODES (LEDS) 公开/授权日：2017-08-10
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