Invention Grant
- Patent Title: Heat dissipation structure for electronic device including antenna module
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Application No.: US16577767Application Date: 2019-09-20
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Publication No.: US10854947B2Publication Date: 2020-12-01
- Inventor: Kwonho Son , Heecheul Moon , Sangyoup Seok
- Applicant: Samsung Electronics Co., Ltd.
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2018-0145694 20181122
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H04B1/00 ; H01L23/34 ; H01L23/36 ; H01Q21/00 ; H05K7/20 ; H01Q1/02 ; H04M1/02 ; H05K5/00 ; H05K5/04

Abstract:
An electronic device is provided. The electronic device includes a housing, a display exposed through at least a portion of the housing, a battery disposed in the housing, an antenna module disposed in the housing and spaced apart from the battery, a first electronic component positioned between the antenna module and the battery, a first heat dissipation member disposed to partially overlap the first electronic component and to extend toward the antenna module, a frame disposed to partially overlap the first heat dissipation member, surround at least a part of the first electronic component, and form a part of an outer appearance of the electronic device, and a heat insulation member interposed between the frame and the first heat dissipation member.
Public/Granted literature
- US20200168977A1 ELECTRONIC DEVICE INCLUDING ANTENNA MODULE Public/Granted day:2020-05-28
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