- 专利标题: Electronic device with speaker module
-
申请号: US16388874申请日: 2019-04-19
-
公开(公告)号: US10856060B2公开(公告)日: 2020-12-01
- 发明人: Hsin Yeh , Jyh-Chyang Tzou , Cheng-Ya Chi , Pai-Feng Chen
- 申请人: Hsin Yeh , Jyh-Chyang Tzou , Cheng-Ya Chi , Pai-Feng Chen
- 申请人地址: TW Taipei
- 专利权人: COMPAL ELECTRONICS, INC.
- 当前专利权人: COMPAL ELECTRONICS, INC.
- 当前专利权人地址: TW Taipei
- 代理机构: JCIPRNET
- 主分类号: H04R1/02
- IPC分类号: H04R1/02 ; H04R1/28 ; H04R1/34 ; G06F1/16 ; H04M1/02
摘要:
An electronic device includes a first body, a second body, and a speaker module. The first body includes a first housing and a second housing disposed on the first housing. The second body is pivotally connected to the first body. The speaker module is movably disposed in the first body. The first body has a first surface and a second surface, and the first surface and the second surface are respectively located at two opposite sides of the speaker module. When the speaker module is abutted against the first surface, the speaker module resonates with the first housing to emit a first sound. When the speaker module is abutted against the second surface, the speaker module resonates with the second housing to emit a second sound.
公开/授权文献
- US20190327544A1 ELECTRONIC DEVICE WITH SPEAKER MODULE 公开/授权日:2019-10-24
信息查询