Invention Grant
- Patent Title: Liquid ejection head, liquid ejection apparatus, and method of manufacturing liquid ejection head
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Application No.: US16453028Application Date: 2019-06-26
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Publication No.: US10857795B2Publication Date: 2020-12-08
- Inventor: Toshiro Murayama , Yuma Fukuzawa , Shunya Fukuda , Kazuaki Uchida , Shunsuke Watanabe , Noriaki Okazawa
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2018-124190 20180629
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A head includes a flow path substrate including a flow path of the liquid in the flow path substrate, a nozzle plate which is attached to the flow path substrate and in which the nozzle is formed, a pressure chamber substrate that is attached to a location facing the nozzle plate with the flow path substrate interposed therebetween and that has a pressure chamber, and a pressure generation portion that operates according to an electrical signal from a wiring substrate coupled to an electrode provided on the pressure chamber substrate and that changes a pressure of the pressure chamber to eject the liquid from the nozzle, in which the nozzle plate and the wiring substrate are disposed such that the nozzle plate does not overlap a coupling portion between the wiring substrate and the electrode when viewed in a thickness direction of the flow path substrate.
Public/Granted literature
- US20200001608A1 LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD Public/Granted day:2020-01-02
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