Invention Grant
- Patent Title: Apparatus and method for selective bonding to form hollow components
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Application No.: US15869836Application Date: 2018-01-12
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Publication No.: US10858945B2Publication Date: 2020-12-08
- Inventor: Daniel A. Bales , Russell A. Beers , Thomas DeMichael , Eric W. Malmborg , Francis B. Parisi
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Kinney & Lange, P.A.
- Main IPC: B23K37/00
- IPC: B23K37/00 ; F01D5/18 ; B29C65/02 ; B23K26/24 ; B23P15/04 ; F01D5/14 ; B23K3/08 ; B23K37/04 ; F01D5/26 ; B23K1/00 ; B23K20/02 ; B23K101/00 ; B23K101/04 ; B23K101/02

Abstract:
An embodiment of an apparatus includes means for peripherally welding a cavity-back blade and a cover of the cavity-back blade to form a 3-dimensional hollow blade assembly, and a plurality of bellows contained in one or both of a first die half and a second die half receiving the 3-dimensional hollow blade assembly. The plurality of bellows are disposed within the region defined around or inward of the peripherally welded interface of the cover and the blade. At least a portion of the plurality of bellows are arranged in a manner to provide pressure to the cover at approximately a 90 degree angle to each of a plurality of nodes, each node defined by an intersection of two or more ribs in the cavity-back blade.
Public/Granted literature
- US20190218915A1 APPARATUS AND METHOD FOR SELECTIVE BONDING TO FORM HOLLOW COMPONENTS Public/Granted day:2019-07-18
Information query
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