Invention Grant
- Patent Title: Coil device
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Application No.: US15610966Application Date: 2017-06-01
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Publication No.: US10861631B2Publication Date: 2020-12-08
- Inventor: Katsumi Kobayashi , Kouyu Ohi
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2016-118957 20160615; JP2017-069891 20170331
- Main IPC: H01F17/04
- IPC: H01F17/04 ; H01F27/29 ; H01F27/28

Abstract:
A coil device includes a core body having a coil core part and a core bottom face, The coil device further includes a coil part forming spiral conductive pathway around the coil core part. A metal electrode is formed at the core bottom face, and the wire ends which are the conductive pathway of the coil part are formed at the metal electrode, and a part of the surface of the metal electrode is covered by a conductive resin electrode.
Public/Granted literature
- US20170365399A1 COIL DEVICE Public/Granted day:2017-12-21
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