Invention Grant
- Patent Title: Coil component
-
Application No.: US15824195Application Date: 2017-11-28
-
Publication No.: US10861637B2Publication Date: 2020-12-08
- Inventor: Hwan Soo Lee , Han Wool Ryu , Hyo Chan Oh , Jin Ho Ku , Byoung Hwa Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0033270 20170316
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F27/24 ; H01F41/04

Abstract:
A coil component includes a support member, an internal coil supported by the support member, and external electrodes connected to the internal coil. The external electrodes may each include a first layer coming into contact with the internal coil and a second layer disposed on a surface of the first layer. The first layer may serve as a buffer layer for improving a contact property between the internal coil and the external electrode. The second layer may be disposed to come into at least partial contact with a first end portion of the support member and a second end portion of the support member.
Public/Granted literature
- US20180268990A1 COIL COMPONENT Public/Granted day:2018-09-20
Information query