Invention Grant
- Patent Title: Apparatus and method for measuring warpage
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Application No.: US16138938Application Date: 2018-09-21
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Publication No.: US10861726B2Publication Date: 2020-12-08
- Inventor: Chun Hung Tsai , Hsuan Yu Chen , Ian Hu , Meng-Kai Shih , Shin-Luh Tarng
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G01N21/95 ; G06T7/00 ; G01B11/25 ; G01N21/956

Abstract:
An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.
Public/Granted literature
- US20200098605A1 APPARATUS AND METHOD FOR MEASURING WARPAGE Public/Granted day:2020-03-26
Information query
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