Invention Grant
- Patent Title: Thermal routing trench by additive processing
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Application No.: US15361397Application Date: 2016-11-26
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Publication No.: US10861763B2Publication Date: 2020-12-08
- Inventor: Benjamin Stassen Cook , Archana Venugopal , Luigi Colombo , Robert Reid Doering
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Michael A. Davis, Jr.; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/495 ; H01L23/48 ; H01L23/52 ; H01L23/367 ; H01L27/02 ; H01L21/3205 ; H01L21/324 ; H01L21/768 ; H01L23/373 ; H01L23/522 ; H01L23/528 ; H01L23/532 ; H01L21/74
Abstract:
An integrated circuit has a substrate which includes a semiconductor material, and an interconnect region disposed on the substrate. The integrated circuit includes a thermal routing trench in the substrate. The thermal routing trench includes a cohered nanoparticle film in which adjacent nanoparticles are cohered to each other. The thermal routing trench has a thermal conductivity higher than the semiconductor material contacting the thermal routing trench. The cohered nanoparticle film is formed by an additive process.
Public/Granted literature
- US20180151464A1 THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING Public/Granted day:2018-05-31
Information query
IPC分类:
