Invention Grant
- Patent Title: Microphone assembly for echo rejection in audio endpoints
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Application No.: US15827457Application Date: 2017-11-30
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Publication No.: US10863035B2Publication Date: 2020-12-08
- Inventor: David William Nolan Robison , Kevin Lee Hughes , Feng Bao
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H04M9/08
- IPC: H04M9/08 ; G10L21/0208 ; H04R1/22 ; H04R1/28 ; H04R1/08 ; H04R3/02 ; H04R3/00 ; H04R27/00

Abstract:
Presented herein is an audio endpoint for telecommunication operations with increased echo rejection. According to one example, the audio endpoint includes a housing body, an upper speaker assembly, a lower speaker assembly, and at least one microphone assembly. The upper speaker assembly is disposed near a top portion of the housing body and has an effective frequency range above a first frequency. The lower speaker assembly is disposed near a bottom portion of the housing body and has an effective frequency range below a second frequency. The microphone assembly includes a first microphone element and a second microphone element. The first microphone element is above the second microphone element so that they are vertically aligned. The first microphone element has an effective frequency range below the first frequency and the second microphone element has an effective frequency range above the second frequency.
Public/Granted literature
- US20190166257A1 MICROPHONE ASSEMBLY FOR ECHO REJECTION IN AUDIO ENDPOINTS Public/Granted day:2019-05-30
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