Invention Grant
- Patent Title: Electronic component
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Application No.: US15940170Application Date: 2018-03-29
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Publication No.: US10886057B2Publication Date: 2021-01-05
- Inventor: Shunji Aoki , Yuya Ishima , Makoto Takahashi , Shougo Okamoto , Takafumi Takahashi , Hajime Kato , Yuto Shiga
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2017-067456 20170330
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/29 ; H01F41/04 ; H01F17/00

Abstract:
An electronic component includes an element body, a conductor, and a plated electrode layer. The element body includes a first outer surface provided with a first recess. The conductor includes a first conductor portion. The first conductor portion is disposed in the first recess and includes a first face opposed to a bottom face of the first recess and a second face opposed to the first face. The plated electrode layer includes a first plating portion covering the second face. The second face includes a first slope inclined with respect to the first outer surface in such a way as to be recessed toward the bottom face side of the first recess from the first outer surface.
Public/Granted literature
- US20180286566A1 ELECTRONIC COMPONENT Public/Granted day:2018-10-04
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