- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US16264603Application Date: 2019-01-31
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Publication No.: US10886233B2Publication Date: 2021-01-05
- Inventor: Wen-Long Lu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L23/31 ; H01L21/56
Abstract:
A semiconductor device package is provided, which includes a substrate, a semiconductor device and an alignment structure. The semiconductor device and the alignment structure are disposed on the substrate. The alignment structure is in direct contact with the semiconductor device.
Public/Granted literature
- US20200251420A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-08-06
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