Invention Grant
- Patent Title: Fan-out semiconductor package
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Application No.: US16351784Application Date: 2019-03-13
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Publication No.: US10886246B2Publication Date: 2021-01-05
- Inventor: Bong Soo Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2018-0087649 20180727
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/532 ; H01L23/48 ; H01L23/31 ; H01L23/495

Abstract:
A fan-out semiconductor package includes: a frame including first to third insulating layers, a first wiring layer disposed on a first surface of the first insulating layer and embedded in the second insulating layer, and a second wiring layer disposed on the third insulating layer, and having a through-hole penetrating through the first to third insulating layers; a semiconductor chip disposed in the through-hole and having an active surface on which connection pads are disposed and an inactive surface opposing the active surface; an encapsulant covering at least portions of each of the frame and the semiconductor chip and filling at least portions of the through-hole; and a connection structure disposed on the frame and the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads. The first and second wiring layers are electrically connected to the connection pads.
Public/Granted literature
- US20200035632A1 FAN-OUT SEMICONDUCTOR PACKAGE Public/Granted day:2020-01-30
Information query
IPC分类: