Invention Grant
- Patent Title: Array substrate and display panel comprising fracture opening for blocking carrier transportation between adjacent sub-pixels
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Application No.: US16400619Application Date: 2019-05-01
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Publication No.: US10886492B2Publication Date: 2021-01-05
- Inventor: Xiaohu Li , Zhiqiang Jiao , Tun Liu , Huajie Yan , Hongsheng Zhan , Liangliang Kang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Collard & Roe, P.C.
- Priority: CN201810502871 20180523
- Main IPC: H01L51/50
- IPC: H01L51/50 ; H01L27/32 ; H01L51/56 ; H01L51/52

Abstract:
An array substrate and a manufacturing method thereof, and a display panel are disclosed. The array substrate includes a base substrate, comprising a plurality of sub-pixel regions and inter-sub-pixel regions between adjacent sub-pixel regions; and a first organic functional layer on the base substrate. At least a portion of the first organic functional layer is in the plurality of sub-pixel regions; and the first organic functional layer includes at least one fracture opening, the at least one fracture opening is configured to block a transportation of the carriers between adjacent sub-pixel regions.
Information query
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