Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US16379016Application Date: 2019-04-09
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Publication No.: US10892318B2Publication Date: 2021-01-12
- Inventor: Shaofeng Ding , Jeong Hoon Ahn
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2018-0103545 20180831
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L29/49 ; H01L23/48 ; H01L49/02 ; H01L21/768

Abstract:
Semiconductor devices including a capacitor in which electrostatic capacity is improved by a simplified process and/or methods for fabricating the same are provided. The semiconductor device including an insulating structure defining a first trench on a substrate, a first conductive layer in the insulating structure, a first portion of an upper surface of the first conductive layer exposed by the first trench, a capacitor structure including a first electrode pattern on the first conductive layer, a dielectric pattern on the first electrode pattern, and a second electrode pattern on the dielectric pattern, the first electrode pattern extending along sidewalls and a bottom surface of the first trench and an upper surface of the insulating structure, and a first wiring pattern on the capacitor structure may be provided.
Public/Granted literature
- US20200075712A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2020-03-05
Information query
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