- 专利标题: Circuit board cooling
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申请号: US16246296申请日: 2019-01-11
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公开(公告)号: US10893628B2公开(公告)日: 2021-01-12
- 发明人: Sankalp Dayal , Vamshi Gangumalla , Zaryab Hamavand , Calin Miclaus
- 申请人: InvenSense, Inc.
- 申请人地址: US CA San Jose
- 专利权人: InvenSense, Inc.
- 当前专利权人: InvenSense, Inc.
- 当前专利权人地址: US CA San Jose
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; G01F1/88 ; H05K7/14 ; G06F1/3296 ; G06F1/3228
摘要:
A circuit board cooling system comprises a cooling unit comprising fans, pressures sensors that measure air pressure at their locations, and a sensor processing unit coupled with the pressure sensors. The cooling unit operates according to an operating configuration and generates air flow to cool a portion of a circuit board. The pressure sensors comprise a first pressure sensor located between the portion of the circuit board and the cooling unit; and a second pressure sensor located such that the portion of the circuit board is between the second pressure sensor and the cooling unit. A sensor processing unit is configured to: obtain the air pressure data measured by the plurality of pressure sensors; and adjust the operating configuration of the cooling unit based on a cooling specification and a comparison of the obtained air pressure data measured by the first pressure sensor and the second pressure sensor.
公开/授权文献
- US20190150316A1 CIRCUIT BOARD COOLING 公开/授权日:2019-05-16
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