Invention Grant
- Patent Title: 2D multi-layer thickness measurement
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Application No.: US16252818Application Date: 2019-01-21
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Publication No.: US10893796B2Publication Date: 2021-01-19
- Inventor: Zhenguo Wang , Zaixing Mao , Kinpui Chan
- Applicant: Topcon Corporation
- Applicant Address: JP Tokyo
- Assignee: Topcon Corporation
- Current Assignee: Topcon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Main IPC: A61B3/10
- IPC: A61B3/10 ; G01B11/06 ; G06T7/00 ; G06T11/60 ; A61B3/14 ; A61B5/00 ; A61B5/107

Abstract:
A method for measuring layer thicknesses of a multi-layer structure includes generating first and second 2D images of the structure, each image being generated by measuring an intensity of a reflection of incident lights, from different discrete narrow spectral bands, on the structure. Thicknesses for at least one layer of the structure are then determined based on the measured reflection intensities at those locations.
Public/Granted literature
- US20190231187A1 2D MULTI-LAYER THICKNESS MEASUREMENT Public/Granted day:2019-08-01
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