Invention Grant
- Patent Title: Heterogeneous multi-layer MMIC assembly
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Application No.: US16390659Application Date: 2019-04-22
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Publication No.: US10896861B2Publication Date: 2021-01-19
- Inventor: David D. Heston , John G. Heston , Claire E. Mooney , Mikel J. White , Jon Mooney , Tiffany Cassidy
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Burns & Levinson, LLP
- Agent Joseph M. Maraia
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/46 ; H01L23/48 ; H01L23/66 ; H01L23/367 ; H01L23/373 ; H01L23/495 ; H01L23/498 ; H01L23/522 ; H01L23/528 ; H01L23/535 ; H01L23/538 ; H01L23/34
Abstract:
An HPA MMIC assembly includes a MMIC device coupled to a thermal spreader. A ground plane is provided on the thermal spreader and coupled to FETs in the MMIC device. The multiple levels of metal separated by multiple dielectric layers provide low-loss broad-band microstrip circuits. The thermal spreader may include diamond, an air/wire-edm spreader or a multi-layer board (MLB) with heat sink vias and ground vias.
Public/Granted literature
- US20200335413A1 Heterogeneous Multi-Layer MMIC Assembly Public/Granted day:2020-10-22
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