- Patent Title: Top structure of super junction MOSFETs and methods of fabrication
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Application No.: US15185507Application Date: 2016-06-17
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Publication No.: US10896959B2Publication Date: 2021-01-19
- Inventor: Jun Hu
- Applicant: Jun Hu
- Applicant Address: US CA San Bruno
- Assignee: Jun Hu
- Current Assignee: Jun Hu
- Current Assignee Address: US CA San Bruno
- Agent Bo-In Lin
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/06 ; H01L29/78 ; H01L29/08 ; H01L29/40

Abstract:
This invention discloses a semiconductor power device formed on an upper epitaxial layer of a first conductivity type supported on a semiconductor substrate. The semiconductor power device having a super junction structure with the epitaxial layer formed with a plurality of vertically extended doped columns of a second conductivity type. The semiconductor power device further comprises a plurality of transistor cells each of the transistor cells comprises a planar gate extending over a top surface and each of the planar gates further includes a middle trench gate extending vertically into the epitaxial layer from a middle portion of the planar gates. Each of the middle trench gates is surrounded by a source region of the first conductivity type encompassed in a body region of the second conductivity type extending substantially between two adjacent doped columns of the second conductivity type.
Public/Granted literature
- US20190221644A1 Top Structure of Super Junction MOSFETS and Methods of Fabrication Public/Granted day:2019-07-18
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