• Patent Title: Top structure of super junction MOSFETs and methods of fabrication
  • Application No.: US15185507
    Application Date: 2016-06-17
  • Publication No.: US10896959B2
    Publication Date: 2021-01-19
  • Inventor: Jun Hu
  • Applicant: Jun Hu
  • Applicant Address: US CA San Bruno
  • Assignee: Jun Hu
  • Current Assignee: Jun Hu
  • Current Assignee Address: US CA San Bruno
  • Agent Bo-In Lin
  • Main IPC: H01L29/10
  • IPC: H01L29/10 H01L29/06 H01L29/78 H01L29/08 H01L29/40
Top structure of super junction MOSFETs and methods of fabrication
Abstract:
This invention discloses a semiconductor power device formed on an upper epitaxial layer of a first conductivity type supported on a semiconductor substrate. The semiconductor power device having a super junction structure with the epitaxial layer formed with a plurality of vertically extended doped columns of a second conductivity type. The semiconductor power device further comprises a plurality of transistor cells each of the transistor cells comprises a planar gate extending over a top surface and each of the planar gates further includes a middle trench gate extending vertically into the epitaxial layer from a middle portion of the planar gates. Each of the middle trench gates is surrounded by a source region of the first conductivity type encompassed in a body region of the second conductivity type extending substantially between two adjacent doped columns of the second conductivity type.
Public/Granted literature
Information query
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/02 .按其半导体本体的特征区分的
H01L29/06 ..按其形状区分的;按各半导体区域的形状、相对尺寸或配置区分的
H01L29/10 ...具有连接到1个不通有待整流、放大或切换的电流的电极上去的半导体区域的;并且这样的电极又是包含3个或更多个电极的半导体器件的组成部分的
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