发明授权
- 专利标题: Method for detecting wafer processing parameters with micro resonator array sensors
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申请号: US16283369申请日: 2019-02-22
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公开(公告)号: US10901021B2公开(公告)日: 2021-01-26
- 发明人: Chuang-Chia Lin , Upendra Ummethala
- 申请人: APPLIED MATERIALS, INC.
- 申请人地址: US CA Santa Clara
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: G01R29/08
- IPC分类号: G01R29/08 ; H01L21/66 ; H01Q1/38
摘要:
Embodiments include systems and methods for determining a processing parameter of a processing operation. Some embodiments include a diagnostic substrate that comprises a substrate, a circuit layer over the substrate, a capping layer over the circuit layer, and a sensing region across the capping layer. In an embodiment, the sensing region comprises, an array of first micro resonators and a second micro resonator. In an embodiment, the array of first micro resonators surround the second micro resonator.
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