Invention Grant
- Patent Title: System and method for electronic die inking after automatic visual defect inspection
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Application No.: US15497925Application Date: 2017-04-26
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Publication No.: US10902576B2Publication Date: 2021-01-26
- Inventor: Eric Robert Trumbauer , Brant William Paquette , Vince Christian Samek , Michael Jay Jenson , David Matthew Curran , Jon Evan Button , Charles David Gordon
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Rose Alyssa Keagy; Charles A. Brill; Frank D. Cimino
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06T7/00 ; G06T7/70

Abstract:
A method of providing a semiconductor device and a computer-readable medium having instructions for performing the method are disclosed. The method includes receiving a first wafer defect map that defines comparison regions and identifies visual defect locations for a wafer. A format of the comparison regions is determined, with the format chosen from a group including die-to-die, partial-shot-to-partial-shot and full-shot-to-full-shot. If the comparison format is not die-to-die, mapping information is received that provides die locations within the comparison regions. A wafer layout map is provided that identifies die locations within the wafer.
Public/Granted literature
- US20180047149A1 System and Method for Electronic Die Inking After Automatic Visual Defect Inspection Public/Granted day:2018-02-15
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