Invention Grant
- Patent Title: Piezoelectric package-integrated film bulk acoustic resonator devices
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Application No.: US15089001Application Date: 2016-04-01
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Publication No.: US10903818B2Publication Date: 2021-01-26
- Inventor: Vijay K. Nair , Feras Eid , Adel A. Elsherbini , Telesphor Kamgaing , Georgios C. Dogiamis , Valluri R. Rao , Johanna M. Swan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H03H9/54
- IPC: H03H9/54 ; H03H9/05 ; H03H9/58 ; G06F1/18 ; H03H9/56

Abstract:
Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.
Public/Granted literature
- US20170285695A1 PIEZOELECTRIC PACKAGE-INTEGRATED FILM BULK ACOUSTIC RESONATOR DEVICES Public/Granted day:2017-10-05
Information query
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