Invention Grant
- Patent Title: Signal processing method and communications chip structure
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Application No.: US16750200Application Date: 2020-01-23
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Publication No.: US10904054B2Publication Date: 2021-01-26
- Inventor: Mingjun Fan , Jianhua Zheng , Daiping Tang
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: Womble Bond Dickinson (US) LLP
- Priority: CN201710640769 20170731
- Main IPC: H04L27/148
- IPC: H04L27/148 ; H04B1/10 ; H04L25/03

Abstract:
This application discloses a communications chip structure, including: a channel selection module, configured to receive an input signal, where the input signal is a signal of a preset narrow bandwidth span or a signal of a preset wide bandwidth span; and a digital baseband module, configured to control the channel selection module to select a first sampling and quantification channel when the input signal is a signal of the preset narrow bandwidth span, or control the channel selection module to select a second sampling and quantification channel when the input signal is a signal of the preset wide bandwidth span. The channel selection module is further configured to send the input signal to the first sampling and quantification channel or the second sampling and quantification channel for sampling and quantification.
Public/Granted literature
- US20200162294A1 SIGNAL PROCESSING METHOD AND COMMUNICATIONS CHIP STRUCTURE Public/Granted day:2020-05-21
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