发明授权
- 专利标题: Wafer-based charged particle accelerator, wafer components, methods, and applications
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申请号: US16538563申请日: 2019-08-12
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公开(公告)号: US10912184B2公开(公告)日: 2021-02-02
- 发明人: Amit Lal , Thomas Schenkel , Arun Persaud , Qing Ji , Peter Seidl , Will Waldron , Serhan Ardanuc , Vinaya Kumar Kadayra Basavarajappa
- 申请人: Cornell University
- 申请人地址: US NY Ithaca
- 专利权人: Cornell University
- 当前专利权人: Cornell University
- 当前专利权人地址: US NY Ithaca
- 代理机构: Perkins Coie LLP
- 主分类号: H05H7/22
- IPC分类号: H05H7/22 ; H05H13/00 ; H05H7/08 ; H05H7/02 ; H05H9/04 ; H05H7/04
摘要:
A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.
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