- 专利标题: Multi-part device enclosure
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申请号: US16145019申请日: 2018-09-27
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公开(公告)号: US10915151B2公开(公告)日: 2021-02-09
- 发明人: Mikael M. Silvanto , Simon J. Trivett , Matthew S. Theobald , Dinesh C. Mathew , Simon R. Lancaster-Larocque , Robert Y. Cao , Ari P. Miller , Kevin M. Robinson , Houtan R. Farahani , Francesco Ferretti , John Raff , Robert J. Lockwood , Genie Kim , Karan Bir , Keith J. Hendren , Gurshan Deol , Antonio Clarke , Prabhu Sathyamurthy , William A. Counts
- 申请人: Apple Inc.
- 申请人地址: US CA Cupertino
- 专利权人: Apple Inc.
- 当前专利权人: Apple Inc.
- 当前专利权人地址: US CA Cupertino
- 代理机构: Brownstein Hyatt Farber Schreck, LLP
- 主分类号: G06F1/18
- IPC分类号: G06F1/18 ; G06F1/16 ; H04M1/02
摘要:
An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
公开/授权文献
- US20190101960A1 MULTI-PART DEVICE ENCLOSURE 公开/授权日:2019-04-04
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