Invention Grant
- Patent Title: Optical module structure and fabrication method for optical module structure
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Application No.: US16692041Application Date: 2019-11-22
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Publication No.: US10921534B2Publication Date: 2021-02-16
- Inventor: Zhen Dong , Jun Liu , Li Zeng , Qing Zhao , Xiaolu Song
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
An optical module structure includes a substrate, an optical chip and an electrical chip that are fixedly coupled to the substrate. The optical module structure further includes an optical coupling structure fixedly coupled to the optical chip. A side of the optical chip that faces the substrate has a first reference plane, and at least one first alignment mark is provided on the first reference plane. The optical coupling structure has a second reference plane, and at least one second alignment mark is provided on the second reference plane. The first reference plane is aligned with the second reference plane, and the first alignment mark is aligned with the second alignment mark.
Public/Granted literature
- US20200096715A1 Optical Module Structure and Fabrication Method for Optical Module Structure Public/Granted day:2020-03-26
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