Invention Grant
- Patent Title: Material sets
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Application No.: US16064994Application Date: 2016-04-15
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Publication No.: US10926464B2Publication Date: 2021-02-23
- Inventor: Sterling Chaffins , Kevin P. DeKam
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Thorpe, North, Western LLP
- International Application: PCT/US2016/027973 WO 20160415
- International Announcement: WO2017/180164 WO 20171019
- Main IPC: B29C64/209
- IPC: B29C64/209 ; B33Y70/00 ; B33Y30/00 ; B33Y80/00 ; B29C64/165 ; C09D11/54 ; B29C64/264 ; B22F3/00

Abstract:
The present disclosure is drawn to material sets for 3-dimensional printing. The material set can include a thermoplastic polymer powder having an average particle size from 20 μm to 100 μm, a conductive fusing ink comprising a transition metal, and second fusing ink. The second fusing ink can include a fusing agent capable of absorbing electromagnetic radiation to produce heat. The second fusing ink can provide a lower conductivity than the conductive fusing ink when printed on the thermoplastic polymer powder.
Public/Granted literature
- US20190001567A1 MATERIAL SETS Public/Granted day:2019-01-03
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