Invention Grant
- Patent Title: Integrated circuit (IC) device
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Application No.: US16358118Application Date: 2019-03-19
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Publication No.: US10930649B2Publication Date: 2021-02-23
- Inventor: Myung-gil Kang , Beom-jin Park , Geum-jong Bae , Dong-won Kim , Jung-gil Yang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2018-0107892 20180910
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L29/08 ; H01L29/78 ; H01L21/8234 ; H01L29/66 ; H01L21/308

Abstract:
An integrated circuit (IC) device includes: a fin-type active area protruding from a substrate and extending in a first horizontal direction; a first nanosheet disposed above an upper surface of the fin-type active area with a first separation space therebetween; a second nanosheet disposed above the first nanosheet with a second separation space therebetween; a gate line extending on the substrate in a second horizontal direction intersecting the first horizontal direction, at least a portion of the gate line being disposed in the second separation space; and a bottom insulation structure disposed in the first separation space.
Public/Granted literature
- US20200083219A1 INTEGRATED CIRCUIT (IC) DEVICE Public/Granted day:2020-03-12
Information query
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