发明授权
- 专利标题: Low profile packaging and assembly of a power conversion system in modular form
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申请号: US15942970申请日: 2018-04-02
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公开(公告)号: US10932366B2公开(公告)日: 2021-02-23
- 发明人: Sunil M. Akre , Shawn X. Arnold
- 申请人: Apple Inc.
- 申请人地址: US CA Cupertino
- 专利权人: Apple Inc.
- 当前专利权人: Apple Inc.
- 当前专利权人地址: US CA Cupertino
- 代理机构: Kilpatrick Townsend & Stockton LLP
- 主分类号: H05K3/30
- IPC分类号: H05K3/30 ; H05K1/14 ; H05K1/16 ; H05K1/18
摘要:
Embedded PCB (printed circuit board) is used for the packaging and assembly of a low profile power conversion system module that can be employed in space constrained environment of small computer/electronic systems. The low profile power conversion system module may include an embedded PCB, a power silicon device embedded within the PCB, a magnetic component which is either embedded within the PCB or disposed on the PCB, or input/output terminals disposed on the side of the embedded PCB. The embedded PCB and the magnetic component may be thin planar shaped to save vertical space. The low profile power conversion system module can be placed inside a cavity formed in the system PCB to save even more vertical space.
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